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Storage and Storage Software

Businesses Risk by Not Profiling Storage

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Businesses Risk by Not Profiling Storage

Enterprise Strategy Group (ESG) research reveals IT teams are putting their infrastructures-- and businesses-- at risk by not profiling application workloads and testing storage systems before purchase and deployment.

The study is co-sponsored by Virtual Instruments, and involves 412 IT professionals. It shows 59% of respondents do not profile workloads before buying a storage system, while 44% do not trust the advice of either storage vendors or VARs regarding the right solution. Such a situation can at best lead to over-provisioning and wasted spending, and at worst to new storage solutions unable to keep up with business requirements.

Making such lack of insight even worse is a failure to gauge the performance of a storage solution before it is put to work. Only 29% of companies conduct on-premises load testing before buying their next storage system, and another 11% would work with vendors or partners to conduct load testing before deciding on a purchase.

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WD Offers 20TB Storage With My Book Duo

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WD Offers 20TB Storage With My Book Duo

Western Digital launches what it says is its highest-capacity storage system yet-- the My Book Duo, a desktop RAID system featuring capacity reaching up to 20TB.

The My Book Duo connects to PCs via USB 3.1, and provides performance reaching up to 360MB/s sequential read via USB-C port. For compatibility with older machines and connection of additional accessories (including drones, action cameras, card readers, keyboards, mice, USB drives or phones) it also features with two USB 3.0 Type-A ports.

WD adds the firmware is RAID-optimised, making it "perfect" for two-disk array systems with drive operation auto management, helping ensure read/write cycle data integrity. Security is also included in the shape of password protection and 256-bit AES hardware encryption with built-in WD Security software.

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Samsung Presents Next V-NAND Generation

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Samsung Presents Next V-NAND Generation

Samsung announces the next generation of 3D vertical NAND memory technology-- including the first 1-Terabit (Tb) V-NAND chip and a NGSFF (Next Generation Small Form Factor) SSD.

As the name suggests, V-NAND stacks memory cells on top of each other, allowing for more density than equivalents built on a single, 2D plane. The result also promises more speed and reliability, as well as less chance of breakdowns. The technology finds applications anywhere from smartphones to datacentres, and has already found its way in a consumer product, specifically 256 gigabit consumer SSDs.

The aforementioned 1Tb V-NAND chip was first mentioned back in 2013, during the unveiling of the technology itself. It launches next year, and will enable the creation of 2TB of memory on a single V-NAND package stacking 16 1Tb dies, making what Samsung claims is "one of the most important memory advances of the past decade."

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Cohesity Updates Orion Storage Software

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Cohesity Updates Orion Storage Software

Cohesity does not take long with updates-- following the April 2017 launch of Orion 4.0 hyperconverged secondary storage solution the startup announces version 5.0.

Orion is described as the first storage solution to combine end-to-end data protection and big data storage with distributed, "infinitely scalable" architecture. The platform spans on-premises and private and public clouds, with control from a single location, and the 5.0 update adds workload backup capability, as well as a searchable archive for large amounts of both structured and unstructured data.

The fully indexed and searchable platform gives admins better access and greater insight into data, and elminates redundant copies. Data is rendered accessible to any application and user via standard protocols, including NFS, CIFS/SMB and S3, driving more efficient data and infrastructure re-use across data protection, archive, content repositories, test/dev and analytic workloads.

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Toshiba Claims QLC BiCS Flash 3D Memory

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Toshiba Claims QLC BiCS Flash 3D Memory

Toshiba announces the development of next generation 4-bit-per-cell quadruple-level cell (QLC) 3D flash memory-- allowing it to produce "the world's largest die capacity" at 768Gb (96GB).

In comparison, 3-bit triple-level cell (TLC) 3D flash maxes out at 512Gb.

The technology involves a 64-layer stacked cell structure, and allows the creation of a 1.5TB device with a 16-die stacked architecture in a single package, making another capacity record. This represents a 50% increase in capacity per package, at least when compared to an earlier Toshiba device with 1TB capacity via 16-die stacked architecture in a single package.

Creating such a device poses a number of challenges, since increasing the number of bits-per-cell by one within the same electron count requires twice the accuracy of TLC technology.

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