Toshiba America Electronic Components (TAEC) launches an e-MMC compliant flash memory module range, using NAND chips fabricated via second generation 19nm technology.
The modules are designed for a wide variety of applications, including smartphones, tablets and video cameras. All are compliant with JEDEC e-MMC version 5.0, achieve high read/write performance via HS400 interface standard and carry 64-Gigabit (equivalent to 8GB) 19mm NAND flash.
The package measures all of 11.5 x 13 x 1.0mm.
Mass production if 16 and 32GB modules kicks off from November 2013, with additional capacities (4, 8, 64, and 128GB) to follow.