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Vendor News

SAP Invests €200 Million in Berlin Campus

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SAP Invests €200 Million in Berlin Campus

SAP announces a €200 million investment in a campus near Berlin central station in a move highlighting not only a focus on areas such as artificial intelligence, machine learning and blockchain, but also the significance of the German capital.

The "Quartier Heidestrasse" has an area of over 30000 square-metres, and offers room for up to 1200 employees. The move to the campus is planned for end 2022. Currently SAP has multiple office locations in the capital area, specifically in Berlin-Mitte and Schoenefeld, SAP Data Space and the SAP Innovation Centre in Potsdam.

“SAP loves Berlin,” the company says. “The capital and its tech ecosystem cannot be overlooked by us and our clients. This applies to the innovations of the future as well as to Berlin’s location as an important job market. Berlin, like no other capital, has a strong appeal beyond Europe.”

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QSC Buys Attero Tech

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QSC Buys Attero Tech

QSC announces the acquisition of Attero Tech, a deal bringing together the Q-SYS audio, video and control ecosystem with the Attero Tech range of networked AV endpoints and I/O peripherals.

The purchase also boosts the development capabilities of QSC, since the Attero Tech engineering staff will join the multi-national QSC team.

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AMD Presents 64-Core Epyc 7H12 Processor

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AMD Presents 64-Core Epyc 7H12 Processor

AMD takes to Rome to announce an addition to the 2nd generation Epyc range-- the Epyc 7H12, a 64-core/128-thread processor running at 2.6GHz base frequency (with 3.3GHz max boost frequency) enhanced for use with liquid cooling.

Aimed at HPC customers, the processor achieves 280W TDP and promises "leadership supercomputing performance." According to testing by French partner Atos using the BullSequana XH2000 supercomputer, the Epyc 7H12 achieves a LINPACK score of 4.2 TeraFLOPS, an 11% improvement over the Epyc 7742. For the curious, the BullSequana XH2000 features uses 32 compute direct liquid cooled blades per rack.

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HP Changes Organisational Structure

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HP Changes Organisational Structure

HP follows on the recent promotion of Imaging, Printing and Solutions head Enrique Lores to CEO with an organisational overhaul, CRN reports-- one seeing the company appoint a first chief commercial officer and move away from the current three-region structure.

Taking the post of CCO is current president of 3D printing and manufacturing Christoph Schell. A company veteran with over 20 years of experience, Schell was previously president of the HP Americas business. HP also names a successor to Lores in Imaging, Printing and Solutions with Tuan Tran, general manager and global head of office printing solutions.

Moving to the change in organisational structure, whereas we know HP as being divided into three large regions (EMEA, the Americas and APJ), come 1 November 2019 the company will be split in 10 geographic markets. Leading each market is a managing director reporting to Schell. In an interview with CRN Lores says the change in structure has been in the works for "some time now," and was set to happen regardless of the decision by CEO Dion Weisler, who stepped down due to a family health matter.

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Intel Details AI Hardware at Hot Chips

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Intel Details AI Hardware at Hot Chips

Intel uses the Hot Chips 31 conference to present the latest from its AI division-- the Nervana neural network processors, with the NNP-T (codenamed "Spring Crest") aimed at training and NNP-I (aka "Spring Hill") for inference.

As the company puts it, dedicated accelerators such as the Nervana NNPs are built with a focus on AI to provide "the right intelligence at the right time." The NNP-T is designed for deep learning training, with the two aims of training the network as fast as possible while doing so within a given power budget. It promises the features and requirements needed to solve for large models, without the overhead to support legacy technology, and can be tailored for a wide range of workloads.

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Dion Weisler Steps Down: Meet the New HP CEO

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Dion Weisler Steps Down: Meet the New HP CEO

HP's board of directors names Enrique Lores, currently President of HP’s Imaging, Printing and Solutions business, the company’s new President and CEO, effective November 1.

Dion Weisler steps down due to a family health matter-- and will return home to Australia. He will work with Lores to ensure a seamless transition and will remain at the company through January 2020. Following this, Weisler will still serve on HP’s board of directors until the next annual meeting of stockholders.

Weisler joined HP in 2012 and has served as President and CEO since Read more...

Intel, Lenovo Partner Up in HPC, AI

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Intel, Lenovo Partner Up in HPC, AI

Intel and Lenovo announce a multi-year collaboration with a focus on high-performance computing (HPC) and artificial intelligence (AI), building on an existing partnership in the datacentre.

Through the team-up Lenovo will optimise the Intel portfolio of HPC and I hardware and software solutions, before bringing about a convergence and AI to "unlock new levels of customer insight." The two companies have already joined forces by combining the 2nd gen Intel Xeon Scalable platform and Lenovo Neptune liquid cooling technology, and currently 173 of the TOP500 fastest supercomputers run on Lenovo servers.

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