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Storage and Storage Software

Intel Intros 660p Series NVMe SSDs

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Intel Intros 660p Series NVMe SSDs

Intel launches what it claims is "the first QLC-based client PCIe SSD in the industry"-- the 660p series, drives built on the M.2-2280 form factor complete with speedy NVMe connectivity.

The 660p features 64-layer 3D QLC flash supplied by Intel-Micron subsidiary IMFlash Technology. According to Intel, "QLC and SLC 'spans' on the drive adjust bi-directionally based on used capacity for the life of the product. Increases in capacity usage trigger the SLC span to decrease, and decreases in capacity usage trigger the SLC span to increase." As mentioned earlier connectivity comes through NVMe, as well as PCIe 3.0x4.

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Nakivo Backup & Replication Reaches v7.5

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Nakivo Backup & Replication Reaches v7.5

Virtualisation and cloud backup specialist Nakivo releases version 7.5 of its flagship Backup & Replication software, with additions including vSphere 6.7 support, advanced bandwidth throttling, cross-platform recovery and compatibility with two more storage devices.

Compatibility with vSphere 6.7 allows customers to seamlessly use Nakivo Backup & Replication to protect upgraded VMware environments, and benefit from features improving backup performance. Meanwhile advanced bandwidth throttling-- an update of the feature from v7.4-- allows for greater convenience and flexibility by creating global rules, as well as setting data transfer speed limits on a per-job basis.

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Toshiba Claims First SSD With 96-Layer 3D Flash

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Toshiba Claims First SSD With 96-Layer 3D Flash

Toshiba Memory announces the XG6-- a first SSD lineup based on 96-layer BiCS FLASH 3D flash memory allowing for read speeds reaching up to 3180MB/s and write speeds of 3000MB/s, as well as 365000 random write IOPS.

The drives will find a variety of uses across the client PC, high-performance mobile, embedded and gaming segments, as well as datacentre environments for boot drives in servers, caching and logging, and commodity storage. They are available in an M.2 2280 single-sided form factor, with support for PCIe Generation 3x4 lane and NVMe revision 1.3a.

Further features include support for user-selectable over provisioning through NVMe command, an improved SLC buffer and optional security with Pyrite or self-encrypting models supporting TCG Opal 2.01, as well as block SID and digital signature.

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Intel and Micron to Update 3D XPoint Memory

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Intel and Micron to Update 3D XPoint Memory

Intel and Micron present an update on the 3D XPoint memory partnership-- the two companies plan to work together on the 2nd generation of the technology, before bringing the collaboration to an end.

The 2nd generation of 3D XPoint technology should be complete sometime on H1 2019, although the companies do not specify whether this involves the sending out of engineering samples, the start of mass productions or the release of commercial products. Either way, once done Intel and Micron will pursue the development of the technology independently, even if both will continue manufacturing products at the Intel-Micron Flash Technologies (IMFT) facility in Lehi, Utah.

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Samsung Mass Produces 5th Gen V-NAND

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Samsung Mass Produces 5th Gen V-NAND

Samsung starts mass production of 5th generation V-NAND memory chips claiming the first use of the "Toggle DDR 4.0" interface, allowing data transmission speeds between storage and memory of 1.4Gbps, a 40% increase over previous versions.

The 256GGb V-NAND offers energy efficiency comparable to the 64-layer predecessor, since operating voltage is down from 1.8V to 1.2V. Meanwhile data write speed reaches 500 microseconds, a 30% improvement over the previous generation, and response time to read-signals is reduced to 50 microseconds. Inside the chip are 90 layers of "3D charge trap flash" (CTF) cells, stacked in a pyramid structure with microscopic channel holes vertically drilled throughout.

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